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? product structure : silicon monolithic integrated circuit ? this product is not designed prot ection against radioactive rays . 1/20 tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 tsz22111 14 001 http://www.rohm.com for air-conditioner fan motor 3-phase brushless fan motor controller BD62012FS ? general description this controller synthesizes the optimal driving signal from hall sensor signals, and outputs the synthesized signal to control the external level shifter and power transistor. the replacement is also easy because of its pin compatibility with bd62011fs and bd62014fs. this controller provides optimum motor drive for a wide variety of applications, and enables motor unit standardization. ? features ?? 150 commutation logic ?? pwm control (upper arm switching) ?? phase control supported from 0 to +30 at 1 intervals ?? rotational direction switch ?? fg signal output with pulse number switch (4 or 12) ?? vreg output (5v/30ma) ?? protection circuits provided: ocp, tsd, uvlo, mlp and the external fault input (fib) ? applications ?? air conditioners; air cleaners; water pumps; dishwashers; washing machines ?? general oa equipment ? key specifications ?? supply voltage range: 10v to 18v ?? duty control voltage range: 2.1v to 5.4v ?? phase control range: 0 to 30 ?? operating temperatur e: -40c to 110 ?? power dissipation: 1.0w ? package w (typ.) x d (typ.) x h (max.) ssop-a24 10.00 mm x 7.80 mm x 2.10 mm ? typical application circuit figure 1. application circuit example - BD62012FS & bm6202fs ssop-a24 r8 r9 vreg vreg c5 hu hv hw vsp fg dtr vcc gnd m vdc BD62012FS bm6202fs r1 r2 r3 r4 r5 r6 r7 q1 c1 c2~c4 c6 c7 c8 c9 c10 c11 c12 c13 d1 c14 not recommended for new designs
2/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? block diagram and pin configuration figure 2. block diagram fi gure 3. pin configuration ? pin descriptions pin name function pin name function 1 gnd signal ground 24 pct vsp offset voltage output pin 2 rt carrier frequency setting pin 23 pc phase control input pin 3 vcc power supply 22 vreg regulator output 4 rcl over current sense pin 21 hup hall input pin phase u+ 5 wl low side driver output phase w 20 hun hall input pin phase u- 6 wh high side driver output phase w 19 hvp hall input pin phase v+ 7 vl low side driver output phase v 18 hvn hall input pin phase v- 8 vh high side driver output phase v 17 hwp hall input pin phase w+ 9 ul low side driver output phase u 16 hwn hall input pin phase w- 10 uh high side driver output phase u 15 vsp duty control voltage input pin 11 fib external fault input (low active) 14 fg fg signal output 12 ccw direction switch (h:ccw) 13 fg s fg pulse # switch (h:12, l:4) gnd rt vcc rcl wl wh vl vh ul uh pct pc vreg hup hun hvp hvn hwp hwn vsp fib cc w fg fgs uh ul vh vl wh wl driver m 21 tsd hup 20 hun 19 hvp 18 hvn 17 hwp 16 hwn uvlo logic driver 10 9 8 7 6 5 vreg 22 vreg 3 vcc 4 filter 14 osc 1 gnd fgs 15 vsp 23 3 hu hv hw fg 5 rcl 13 a / d pc pwm ccw 12 fib 11 vreg rt 2 test vreg vdc 24 pct v/i + fault not recommended for new designs
2/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? block diagram and pin configuration figure 2. block diagram fi gure 3. pin configuration ? pin descriptions pin name function pin name function 1 gnd signal ground 24 pct vsp offset voltage output pin 2 rt carrier frequency setting pin 23 pc phase control input pin 3 vcc power supply 22 vreg regulator output 4 rcl over current sense pin 21 hup hall input pin phase u+ 5 wl low side driver output phase w 20 hun hall input pin phase u- 6 wh high side driver output phase w 19 hvp hall input pin phase v+ 7 vl low side driver output phase v 18 hvn hall input pin phase v- 8 vh high side driver output phase v 17 hwp hall input pin phase w+ 9 ul low side driver output phase u 16 hwn hall input pin phase w- 10 uh high side driver output phase u 15 vsp duty control voltage input pin 11 fib external fault input (low active) 14 fg fg signal output 12 ccw direction switch (h:ccw) 13 fg s fg pulse # switch (h:12, l:4) gnd rt vcc rcl wl wh vl vh ul uh pct pc vreg hup hun hvp hvn hwp hwn vsp fib cc w fg fgs uh ul vh vl wh wl driver m 21 tsd hup 20 hun 19 hvp 18 hvn 17 hwp 16 hwn uvlo logic driver 10 9 8 7 6 5 vreg 22 vreg 3 vcc 4 filter 14 osc 1 gnd fgs 15 vsp 23 3 hu hv hw fg 5 rcl 13 a / d pc pwm ccw 12 fib 11 vreg rt 2 test vreg vdc 24 pct v/i + fault not recommended for new designs
4/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 7) output duty pulse width limiter pulse width duty is controlled during pwm switching in order to ensure the operation of external power transistor. the controller doesn?t output pulse of less than t min (0.8s minimum), nor output a duty pulse of d max or more. dead time is forcibly provided to prevent external power transistors to tu rn-on simultaneously in upper and lower side in driver output (for example, uh and ul) of each arm. this will not overlap the minimum time t dt (1.6s minimum). because of this, the maximum duty of 120 square wave driv e at start up is 90% (typical). 8) phase control setting the driving signal phase can be advanced to the hall signal for phase control. the lead angle is set by forcing dc voltage to the pc pin. the input voltage is converted digitally by a 6-bit a/d converter, in which internal vreg voltage is assumed to be full-scale, and the converted data is processed by a logic circuit. the lead angle can be set from 0 to +30 at 1 intervals, and updated four th hall cycle of phase w falling edge. phas e control function onl y operates at 150 commutation mode. however, the controller forces pc pin vo ltage to ground (no lead angle) during testing mode. the vsp offset voltage (figure 29) is buffered to pct pin, to connect an external resistor between pct pin and ground. the internal bias current is determined by pct voltage and the resistor value - v pct / r pct -, and mixed to pc pin. as a result, the lead angle setting is followed with the duty control voltage, and the performance of the motor can be improved. please select the r pct value from 50 k ? to 200 k ? in the range on the basis of 100 k ? , because the pct pin current capability is a 100 a or less. figure 4. phase control setting example 1 figure 5. phase control setting example 2 9) overcurrent protection (ocp) circuit the over current protection circuit can be activated by connec ting a low value resistor for current detection between the external output stage ground and the controller ic ground. when the rcl pin voltage reaches or surpasses the threshold value, the controller forces all the upper switching arm inputs lo w (uh, vh, wh = l, l, l), th us initiating the overcurrent protection operation. when the rcl pin voltage swings below the ground, it is recommended to insert a resistor - 1.5 k ? or more - between rcl pin and current detection resistor to pr event malfunction. since this protection circuit is not a latch type, it returns to normal operation - synchronizing with the carrier frequency - once the rcl pin voltage falls below the threshold voltage. a filter is built into the overcurrent detection circuit to prevent malfunctions, and does not activate when a short pulse of less than t rcl is present at the input. 10) under voltage lock out (uvlo) circuit to secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, an uvlo circuit is built into this controller. when the power supply voltage falls to v uvl or below, the controller forces all driver outputs low. when the voltage rises to v uvh or above, the uvlo circuit ends the lock out operation and returns the chip to normal operation. the voltage monitor circuit (4.0v nominal) is built-in for the vreg voltage. therefore, the uvlo circuit does not release operation when the vreg voltage rising is delayed behind the vcc voltage rising even if vcc voltage becomes v uvh or more. l.a. vsp pc r pcl pct r pc t vsp adc l.a. r pc t v pct v spmin v pct = vsp-v spmin l.a. vsp pc r pcl pct r pc h vreg r pc t vsp adc l.a. r pc t v pct v spmin v pct = vsp-v spmin not recommended for new designs
5/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 11) thermal shutdown (tsd) circuit the tsd circuit operates when the juncti on temperature of the controller exceeds the preset temperature (175c nominal). at this time, the controller forces all driver outputs low. since thermal hy steresis is provided in the tsd circuit, the chip returns to normal operation when the junction temper ature falls below the preset temperature (150c nominal). the tsd circuit is designed only to shut the ic off to prev ent thermal runaway. it is not designed to protect the ic or guarantee its operation in the pres ence of extreme heat. do not continue to use the ic after the tsd circuit is activated, and do not use the ic in an environment where activation of the circuit is assumed. 12) motor lock protection (mlp) circuit when the controller detects the motor locking during fixed time of 4 seconds nominal when each edge of the hall signal doesn't input either, the controller forces all driver outputs low under a fixed time 20 seconds nominal, and self-returns to normal operation. this circuit is enabled if the voltage force to vsp is over the duty minimum voltage v spmin , and note that the motor cannot start up when the controller doesn?t detect the motor ro tation by the minimum duty control. 13) external fault signal input pin (fib pin, low active) the fib pin can force all controller driver outputs low at any time. the fib pin is pulled up to vreg internally by a 100 k? resistor. therefore, an open drain out put can be connected directly. it is re commended to pull up fib pin to vreg voltage when this function is not used or malfunctioning because of the noise. 14) hall signal wrong input detection hall element abnormalities may cause incorrec t inputs that vary from the normal lo gic. when all hall input signals go high or low, the hall signal wrong input detection circuit forces all driver outputs low. and when the controller detects the abnormal hall signals continuously for four times or more moto r rotation, the controller forces all driver outputs low and latches the state. it is released if the duty control voltage vsp is forced to ground level once. 15) internal voltage regulator the internal voltage regulator vreg is output for the bias of the hall element and the phase control setting. however, when using the vreg function, be aware of the i omax value. if a capacitor is connected to the ground in order to stabilize output, a va lue of 1 f or more should be used. in this case, be sure to confirm that there is no oscillation in the output. figure 6. vreg output pin application example hup hun hvp hvn hwp hwn hu hv hw vcc controller ic r1 vreg not recommended for new designs
6/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? timing charts (cw) figure 7. BD62012FS (clockwise) timing charts pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm hall u pwm hall v hall w pwm pwm pwm uh pwm pwm pwm vh wh ul vl wl uh vh wh ul vl wl uh vh wh ul vl wl fg hall signals spin up (hall period < 5hz) cw direction (lead=0deg) cw direction (lead=30deg) fg output (fgs=h) not recommended for new designs
7/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? timing charts (ccw) figure 8. BD62012FS (counter clockwise) timing charts pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm hall u pwm hall v hall w pwm pwm pwm uh pwm pwm pwm vh wh ul vl wl uh vh wh ul vl wl uh vh wh ul vl wl fg hall signals spin up (hall period < 5hz) ccw direction (lead=0deg) ccw direction (lead=30deg) fg output (fgs=h) not recommended for new designs
8/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? controller outputs and operation mode summary detected direction forward (cw:u~v~w, ccw :u~w~v) reverse (cw:u~w~v, ccw:u~v~w) conditions hall sensor period < 5hz 5hz < < 5hz 5hz < vsp < v spmin (duty off) upper and lower arm off v spmin < vsp < v spmax (control range) 150 upper switching normal operation v sptst < vsp (testing mode) 120 upper and lower switching 150 upper switching (no lead angle) 120 upper and lower switching 120 upper switching overcurrent upper arm off upper and lower arm off uvlo tsd motor lock external input upper and lower arm off protect operation hall sensor abnormally upper and lower arm off and latch * the controller monitors both edges of three hall sensors for detecting period. * phase control function only operates at 150 commutation mode. however, the controller forces no l ead angle during the testin g mode. ? absolute maximum ratings (ta=25c, all voltages are with respect to ground) ratings parameter symbol BD62012FS unit supply voltage v cc 20* 1 v duty control voltage v sp -0.3 to 20 v all others v i/o -0.3 to 5.5 v driver outputs i omax(out) 15* 1 ma monitor output i omax(fg) 5* 1 ma vreg outputs i omax(vreg) -40* 1 ma operating temperature t opr -40 to 110 c storage temperature t stg -55 to 150 c power dissipation pd 1.00* 2 w junction temperature t jmax 150 c *1 do not, however, exceed pd or aso. *2 mounted on a 70mm x 70mm x 1.6mm fr4 glass-epoxy board wi th less than 3% copper foil. de rated at 8mw/c above 25c. ? operating conditions (ta=25c) parameter symbol BD62012FS unit supply voltage v cc 10 to 18 v not recommended for new designs
9/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? electrical characteristics (unless otherwise specified, ta=25c and vcc=15v) limits parameter symbol min. typ. max. unit conditions power supply supply current i cc 1.3 2.5 5.0 ma vreg voltage v reg 4.5 5.0 5.5 v i o =-30ma driver outputs output high voltage v oh v reg -0.60 v reg -0.20 v reg v i o =-5ma output low voltage v ol 0 0.14 0.60 v i o =5ma dead time t dt 1.6 2.0 2.4 s minimum pulse width t min 0.8 1.0 1.2 s hall comparators input bias current i hall -2.0 -0.1 2.0 a v in =0v common mode input v hallcm 0 - v reg -1.5 v minimum input level v hallmin 50 - - mv p-p hysteresis voltage p v hallhy+ 5 13 23 mv hysteresis voltage n v hallhy- -23 -13 -5 mv duty control input bias current i sp 15 25 35 a v in =5v duty minimum voltage v spmin 1.7 2.1 2.5 v duty maximum voltage v spmax 5.0 5.4 5.8 v testing operation range v sptst 13 - 18 v minimum output duty d min 1.2 1.8 2.4 % f osc =18khz maximum output duty d max 92 95 98 % f osc =18khz mode switch and the external input - fgs, ccw and fib input bias current i in -70 -50 -30 a v in =0v input high voltage v inh 3 - vreg v input low voltage v inl 0 - 1 v hysteresis voltage v inhy 0.2 0.5 0.8 v monitor output - fg output high voltage v monh v reg -0.40 v reg -0.08 v reg v i o =-2ma output low voltage v monl 0 0.06 0.40 v i o =2ma overcurrent protection input bias current i rcl -30 -20 -10 a v in =0v threshold voltage v rcl 0.48 0.50 0.52 v noise masking time t rcl 0.8 1.0 1.2 s phase control minimum lead angle p min - 0 1 deg v pc =0v maximum lead angle p max 29 30 - deg v pc =1/2v reg carrier frequency oscillator carrier frequency f osc 16 18 20 khz r t =22k ? under voltage lock out release voltage v uvh 8.5 9.0 9.5 v lockout voltage v uvl 7.5 8.0 8.5 v hysteresis voltage v uvhy 0.5 1.0 1.5 v not recommended for new designs
10/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) figure 11. vreg drive capability figure 12. high side output voltage (xh, xl) figure 9. circuit current figure 10. vreg - vcc 0 1 2 3 4 9 12151821 supply voltage : vcc [v] circuit current : i cc [ma] 110c 25c -40c 4.6 4.8 5.0 5.2 5.4 9 12151821 supply voltage : vcc [v] vreg voltage : v reg [v] 25c 110c -40c 4.6 4.8 5.0 5.2 5.4 0 10203040 output current : i out [ma] vreg voltage : v reg [v] 25c 110c -40c -1.6 -1.2 -0.8 -0.4 0.0 0 4 8 12 16 output current : i out [ma] output drop voltage : ? voh [v] -40c 25c 110c not recommended for new designs
11/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued figure 15. hall comparator hysteresis voltage figure 16. vsp input bias current figure 13. low side output voltage figure 14. hall comparator input bias current (xh, xl) (hxp, hxn) 0.0 0.4 0.8 1.2 1.6 0 4 8 12 16 output current : i out [ma] output voltage : vol [v] _ 110c 25c -40c -0.20 -0.15 -0.10 -0.05 0.00 01234 input voltage : v inhxp [v] input bias current : i hall [a] 110c 25c -40c -1 0 1 2 3 4 5 6 -30 -15 0 15 30 differential voltage : v hup -v hun [mv] output voltage : v wh [v] 110c 25c -40c 110c 25c -40c 0 50 100 150 200 0 5 10 15 20 vsp voltage : vsp [v] input bias current : i sp [a] 110c 25c -40c not recommended for new designs
12/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued figure 19. high side output voltage figure 20. low side output voltage (fg) (fg) figure 17. output duty - vsp voltage figure 18. testing mode threshold voltage 0 20 40 60 80 100 02468 vsp voltage : vsp [v] output duty : d sp [%] 110c 25c -40c -0.5 0.0 0.5 1.0 1.5 0 5 10 15 20 vsp voltage : vsp [v] internal logic : h/l [-] 110c 25c -40c -0.8 -0.6 -0.4 -0.2 0.0 0246 output current : i out [ma] output drop voltage : ? voh [v] -40c 25c 110c 0.0 0.2 0.4 0.6 0.8 0246 output current : i out [ma] output voltage : vol [v] _ 110c 25c -40c not recommended for new designs
13/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued figure 23. rcl input bias current figure 24. rcl input threshold voltage figure 21. input bias current figure 22. input threshold voltage (ccw, fib) (ccw, fib) 0 10 20 30 40 50 60 012345 input voltage : v in [v] input bias current : i in [a] 110c 25c -40c -0.5 0.0 0.5 1.0 1.5 1.71.92.12.32.52.72.9 input voltage : v in [v] internal logic : h/l [-] 110c 25c -40c 110c 25c -40c 0 10 20 30 012345 rcl input voltage : v rcl [v] rcl input bias current : i rcl [a] 110c 25c -40c -0.5 0.0 0.5 1.0 1.5 0.48 0.49 0.50 0.51 0.52 input voltage : v rcl [v] internal logic : h/l [-] 110c 25c -40c not recommended for new designs
14/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued figure 27. thermal shut down figure 28. under voltage lock out (vcc) figure 25. input bias current figure 26. input threshold voltage (fgs) (fgs) 0 10 20 30 40 50 60 012345 input voltage : v in [v] input bias current : i in [a] 110c 25c -40c -0.5 0.0 0.5 1.0 1.5 1.71.92.12.32.52.72.9 input voltage : v in [v] internal logic : h/l [-] 110c 25c -40c 110c 25c -40c -0.5 0.0 0.5 1.0 1.5 125 150 175 200 junction temperature : tj [c] internal logic : h/l [-] 0 1 2 3 4 5 6 7.0 7.5 8.0 8.5 9.0 9.5 10.0 supply voltage : vcc [v] uh voltage : v uh [v] 110c -40c 25c - 40c 110c 25c not recommended for new designs
15/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued figure 31. pc voltage normalized - lead angle figure 32. carrier frequency - rt figure 29. vsp - pct offset voltage figure 30. pct - pc linearity (r pct =r pc =100k ? ) 0 10 20 30 40 50 60 0.00.20.40.60.81.0 v pc /v reg (normalized) : [v/v] phase : la [deg] 110c 25c -40c 0 1 2 3 4 5 01234567 vsp voltage : vsp [v] pct voltage : v pct [v] 110c 25c -40c 10 15 20 25 30 14 18 22 26 30 external resistor : r t [kohm] frequency : f osc [khz] 110c 25c -40c 0 1 2 3 4 01234 pct voltage : v pct [v] pc voltage : v pc [v] 110c -40c 25c not recommended for new designs
16/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? application circuit example figure 33. application circuit example (150 commutation driver) parts list parts value manufacturer type parts value ratings type ic1 - rohm BD62012FS c1 0.1f 50v ceramic ic2 - rohm bm6202fs c2~4 2200pf 50v ceramic r1 1k ? rohm mcr18ezpf1001 c5 10 f 50v ceramic r2 150? rohm mcr18ezpj151 c6 10 f 50v ceramic r3 22k ? rohm mcr18ezpf2202 c7~9 1f 50v ceramic r4 100k ? rohm mcr18ezpf1003 c10 0.1f 50v ceramic r5 51k ? rohm mcr18ezpf5102 c11 1f 50v ceramic r6 0.5? rohm mcr50jzhfl1r50 x 3 c12 100pf 50v ceramic r7 10k ? rohm mcr18ezpf1002 c13 0.1f 630v ceramic r8 0 ? rohm mcr18ezpj000 c14 0.1f 50v ceramic r9 0 ? rohm mcr18ezpj000 hx - - hall elements q1 - rohm dtc124eua d1 - rohm kdz20b r8 r9 vreg vreg c5 hu hv hw vsp fg dtr vcc gnd m vdc ic1 ic2 r1 r2 r3 r4 r5 r6 r7 q1 c1 c2~c4 c6 c7 c8 c9 c10 c11 c12 c13 d1 c14 not recommended for new designs
17/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? interfaces figure 34. rt figure 35. rcl figure 36. vsp figure 37. vreg, vcc figure 38. xh, xl, fg figure 39. hxp, hxn figure 40. fgs, ccw, fib figure 41. pc, pct uh,vh,wh vreg ul,vl,wl fg hup hun 2k hvp hvn hwp hwn rt 2k rcl 250k vreg vreg 100k vsp 100k vcc vreg vreg 100k ccw fgs fib vreg pc pct 2k 2k 2k not recommended for new designs
18/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? notes for use 1) absolute maximum ratings devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. because the cause of this damage cannot be identified as, for example, a short circuit or an op en circuit, it is important to consider circuit protection measures, such as adding fuses, if any value in excess of absolute maximum ratings is to be implemented. 2) electrical potential at gnd keep the gnd terminal to the minimum potential under any op erating condition. in addition, check to determine whether there is any terminal that provides vo ltage below gnd, including the voltage during transient phenomena. however, note that even if the voltage does not fall bel ow gnd in any other operating condition, it can still swing below gnd potential when the motor generates back electromotiv e force at the rcl terminal. the chip layout in this product is designed to avoid this sort of electrical potential problem, but pulling excessive current may st ill result in malfunctions. therefore, it is necessary to observe operation closely to conclusively confirm that there is no problem in actual operation. if there are small signal gnd and high current gnd, it is recommend ed to separate the patterns for the high current gnd and the small signal gnd and provide a proper grounding to the refer ence point of the set not to affect the voltage at the small signal gnd with the change in voltage due to resistance compon ent of pattern wiring and high current. also for gnd wiring pattern of the component externally connected, pay spec ial attention not to cause undesirable change to it. 3) driver outputs the high voltage semiconductor generally driven by this produc t is connected to the next stage via the controller. if any special mode in excess of absolute maximum ratings is to be im plemented with this product or its application circuits, it is important to take physical safety measures, such as providing voltage-clamping diodes or fuses. 4) thermal design use a thermal design that allows sufficie nt margin in light of the power dissipa tion (pd) in actual operating conditions. 5) inter-pin shorts and mounting errors take caution when positioning the ic for mounting on printe d circuit boards. the ic may be damaged if there is any connection error or if pins are shorted together. also, connecti ng the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting t he power supply lines, such as establishing an external diode between the power supply and t he ic power supply pin. 6) operation in strong electromagnetic fields using this product in strong electromagnetic fields may caus e ic malfunctions. take extreme caution with electromagnetic fields. 7) testing on application boards when testing the ic on an application board, connecting a capacitor to a low impedance pin subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution w hen transporting or storing the ic. 8) regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elem ents, in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relati on between each potential is as follows: when gnd > pin a and gnd > pin b, the p- n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. theref ore, do not use methods by which parasitic diodes operate, such as applying a voltage lo wer than the gnd (p substrate) voltage to an input pin. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic elemen t pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd parasitic element appendix: example of monolithic ic structure parasitic element not recommended for new designs
19/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? ordering information ? physical dimension, tape and reel information ? marking diagram 1pin mark lot no. product name ssop-a24 (top view) BD62012FS b d 6 2 0 1 2 f s - e 2 rohm part number package fs : ssop-a24 packaging specification e2 : embossed taping not recommended for new designs
20/20 datasheet datasheet BD62012FS tsz02201-0828abb00020-1-2 ? 2013 rohm co., ltd. all rights reserved. 15.mar.2013 rev.003 http://www.rohm.com tsz22111 15 001 ? revision history date revision changes 26.mar.2012 001 new release 08.feb.2013 002 proofreading implementation of the translation from japanese into english 15.mar.2013 003 correct some misdescriptions not recommended for new designs
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification not recommended for new designs
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. not recommended for new designs
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. not recommended for new designs

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